Semiconductor
Diamond Material is used in CMP slurries and polishing processes for silicon, SiC, and GaN wafers, delivering ultra-low surface roughness and high material removal rates required for advanced node devices and power semiconductors.
We focus on high-end industries where HTHP and CVD diamonds genuinely improve product performance. Our customers include world-class companies in optics, semiconductors, thermal management, and advanced materials.
Diamond Material is used in CMP slurries and polishing processes for silicon, SiC, and GaN wafers, delivering ultra-low surface roughness and high material removal rates required for advanced node devices and power semiconductors.

Used in the precision polishing of optical glass, sapphire, and infrared crystals, Diamond Material produces sub-nanometer surface finishes for lenses, prisms, IR windows, and high-end imaging components.

Diamond abrasives and tools enable efficient grinding, lapping, and polishing of structural and functional ceramics such as alumina, zirconia, and silicon nitride for semiconductor, medical, and industrial applications.

CVD diamond delivers the highest thermal conductivity of any bulk material, making it the ideal heat spreader for high-power electronics, RF devices, laser diodes, and GaN-on-diamond modules where conventional materials cannot dissipate heat fast enough.

Diamond is the abrasive of choice for cutting, grinding, and dressing tools used in advanced manufacturing — from CNC tooling and wire saws to PCD inserts and dressers for ultra-precision machining.

Specialty uses across aerospace, scientific instruments, functional textiles, electroplating, heat dissipation, and biomedical fields, where Diamond Material unlocks performance unattainable with conventional materials.
Our overseas customer base includes both large corporations and mid-sized technology-driven companies actively integrating diamond materials into real products.
100+ active opportunities. 30+ cooperating customers. Direct access to global industry leaders across Europe, the US, Japan, Taiwan, and South Korea — backed by years of on-the-ground execution.